(719) 570-1150

Multi-Wire Diamond Wire Saw

Ideal for low to medium volume production house or R&D facility

RTD Series Multi-Wire Diamond Wire Saw

RTD Series Multi-Wire

High-precision multi-wire slicing for applications requiring extremely small slice thickness and tight tolerances.

FEATURES

  • Supports slices as small as 0.5 mm to 6 mm
  • Compatible with 150 mm wire guides, or 225 mm with optional configuration
  • Simple, robust design minimizes maintenance costs and reduces downtime
  • Wire speeds up to 12 m/s
  • PLC-controlled tension system with load-cell feedback
  • Touchscreen HMI with 40 stored recipes
  • Precision table included as a standard feature

BENEFITS

  • Ideal for SiC, Sapphire, and materials listed under MWX specifications
  • Low-kerf slicing significantly increases yield
  • Efficient wire usage - increases cutting speed and enables wire changes in minutes
  • Wire break detection is standard
TECHNICAL SPECIFICATION RTD6400 RTD6800 & RTD6800+
Cut Envelope (W/H/D) RTD6400: 101 mm x 203 mm x 150 mm
RTD6800: 203 mm x 203 mm x 150 mm
RTD6800+: 203 mm x 203 mm x 225 mm
Saw Dimensions W: 1415 mm / 56"
H: 2640 mm / 104"
D: 865 mm / 34"
Saw Weight 1180 Kg
2600 Lbs
Power Requirements 30 amp, 3-phase, 208-230 volts, 50/60 Hz
Wire Speed Max 12 m/sec
Tension Max 40N
Cutting Fluid Tank Capacity Max: 95 Liter / 25 Gallon
Indexing Table Accuracy (mm) ±0.050
MWX Series diamond wire slicing machine

MWX Series Multi-Wire

Engineered for production environments requiring tight tolerances, high throughput, and superior surface quality.

FEATURES

  • High wire speeds up to 25 m/s boost cutting efficiency
  • PLC-controlled tension with load-cell feedback ensures consistency across multiple wires
  • Touchscreen HMI with 30 recipe capacity
  • Supports wire pitch from 2–5 mm with up to 50 wraps
  • Standard indexing table for accurate, repeatable positioning
  • Note: Typical cutting speed: ~1 mm/min, depending on material and process parameters


BENEFITS

  • Ideal for slicing SiC, Sapphire, neodymium, simco (selenium cobalt), and similar materials
  • Multi-wire capability enables multiple slices per pass for exceptional throughput
  • Minimal kerf loss for improved surface finish and reduced material waste
TECHNICAL SPECIFICATION MWX250
Cut Envelope (W/H/D) 250 mm x 250 mm x 100 mm
Saw Dimensions W: 1075 mm / 42"
H: 2040 mm / 80"
D: 930 mm / 37"
Saw Weight 635 Kg
1400 Lbs
Power Requirements 20 amp, 3-phase, 480 volts, 50/60 Hz
Wire Speed Max 25 m/sec
Tension Max 45N
Cutting Fluid Tank Capacity Max: 64 Liter / 17 Gallon
Indexing Table Accuracy (mm) ±0.050

The RTD Series Multi-Wire Saws in Action:

  • Cuts extremely hard and or extremely brittle materials effectively and gently with superior finishes
  • Fantastic solution for sapphire, ceramics, quartz, optic glass, medical applications, compound semiconductors
  • Small footprint and low operating costs
  • Versatile multi-wire diamond saws bring efficient cutting with speed, precision, and material savings
Man in laboratory inspecting semiconductor wafer
Hard drive storage disk
Four surface preparation examples
Single-side polishing machine
Large boule being cut by a diamond wire
Smooth material example cuts
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Flag of the United States  Our products are designed and manufactured in North America.

3525 North Stone Avenue, Ste 100, Colorado Springs, CO 80907, USA
(719) 570-1150
FINE GRINDING, LAPPING & POLISHING
DIAMOND WIRE SAWS