(719) 570-1150

Multi-Wire Diamond Wire Saw

Ideal for low to medium volume production house or R&D facility

RTD Series Multi-Wire Diamond Wire Saw

RTD Series Multi-Wire Saw


  • Processes Ingots up to 200mm diameter and 225mm long with as many as 300 slices at a time
  • Minimally destructive, low-kerf slicing with diamond wire increases yield by saving material
  • Simple, robust design minimizes maintenance costs and reduces downtime
  • Operator-friendly 15”, Color Touchscreen allows for simple programming of recipes and ease of use
  • Tangential cutting method for increased surface finish quality and decreased cut time
  • PLC controlled tensioning system with load cell feedback for accurate wire tension required for different wire sizes
  • Smallest footprint available in a multi-wire saw (1.3 m²)
  • Multiple wire break detection systems minimizes material loss due to wire breaks
  • CE compliant


  • Ideal for cutting hard and brittle materials such as: silicon, silicon carbide, quartz, fused silicon glass, ceramics, graphite, sapphire, germanium, etc.
  • Increased working speed over conventional slurry process
  • Adaptable design allows for many different process types from single-wire cropping to multi-wire slicing
  • Efficient wire usage - increases cutting speed and enables wire changes in minutes
  • Wire break detection is standard
Work Piece Dimensions RTD6400: 150 mm L x 100 mm W x 200 mm H
RTD6800: 150 mm L x 200 mm W x 200 mm H
Loading Length 150 mm - 225 mm (with extended web option)
Workpiece Weight (Max) 180 Kg
Yoke Speed (min-max) min: 0.001
max: 200
Power Requirements 30 amp, 3-phase, 220 volt, 50/60 Hz
Compressed Air Pressure: 207 kPa (80 psi) Volume: 0.14 m³/min (5 cfm)
Cutting Fluid Tank Capacity 110 L
MWX Series diamond wire slicing machine

MWX250 Multi-Wire


  • Reel-to-Reel Diamond Wire saw capable of multi-wire slicing up to 100mm of material in a single pass
  • Designed to meet the emerging need of SiC Cropping and Seed generation
  • Proven technology based on NCX250
  • Minimal footprint: 42” Wide x 28” Deep x 80” Tall, ~700kg (1500lbs)
  • 10” Touch-screen Graphic User Interface • MES Capable


  • Slip-on wire guides for quick turn from process to process
  • Compact footprint to minimize space requirements
  • Adaptable from multi-wire to single-wire configuration in minutes allowing for the throughput of a multi-wire saw with the versatility of a single-wire saw
  • Increased working speed over conventional slurry process
  • High-end Yaskawa controls with load cell feedback for high wire speed and consistent tension control
  • Fixturing available for automated integration
  • Wire break detection is standard
Work Piece Dimensions 250 mm x 250 mm x100 mm
(235 mm of table travel for single-wire application)
Work Table Optional
Saw Dimensions W: 1104 mm / 43.46"
H: 2047 mm / 80.56"
D: 924 mm / 36.37"
Saw Weight (Max) 583 Kg
1285 Lbs
Diamond Wire Max capacity: Up to 15km of 175μm core wire
Power Requirements (V/f/A/ph) 480 V / 50-60 Hz 20 Amp 3 phase
Yoke Speed (mm/min) min: 0.001
max: 200
Wire Speed (m/s) max: 30 m/s
Tension up to 45 N
Fluid Tank 70 Liter
18.5 Gallon
Indexing Table Accuracy (mm) Standard: ±0.015
Optional: ±0.003
Wire Web 100 mm web length wth a minimum pitch of 0.500 mm

The RTD Series Multi-Wire Saws in Action:

  • Cuts extremely hard and or extremely brittle materials effectively and gently with superior finishes
  • Fantastic solution for sapphire, ceramics, quartz, optic glass, medical applications, compound semiconductors
  • Small footprint and low operating costs
  • Versatile multi-wire diamond saws bring efficient cutting with speed, precision, and material savings
Man in laboratory inspecting semiconductor wafer
Hard drive storage disk
Four surface preparation examples
Single-side polishing machine
Large boule being cut by a diamond wire
Smooth material example cuts

Flag of the United States  Our products are designed and manufactured in North America.

3525 North Stone Avenue, Ste 100, Colorado Springs, CO 80907, USA
(719) 570-1150