RTD Series Multi-Wire Saw
FEATURES
- Processes Ingots up to 200mm diameter and 225mm long with as many as 300 slices at a time
- Minimally destructive, low-kerf slicing with diamond wire increases yield by saving material
- Simple, robust design minimizes maintenance costs and reduces downtime
- Operator-friendly 15”, Color Touchscreen allows for simple programming of recipes and ease of use
- Tangential cutting method for increased surface finish quality and decreased cut time
- PLC controlled tensioning system with load cell feedback for accurate wire tension required for different wire sizes
- Smallest footprint available in a multi-wire saw (1.3 m²)
- Multiple wire break detection systems minimizes material loss due to wire breaks
- CE compliant
BENEFITS
- Ideal for cutting hard and brittle materials such as: silicon, silicon carbide, quartz, fused silicon glass, ceramics, graphite, sapphire, germanium, etc.
- Increased working speed over conventional slurry process
- Adaptable design allows for many different process types from single-wire cropping to multi-wire slicing
- Efficient wire usage - increases cutting speed and enables wire changes in minutes
- Wire break detection is standard
| SPECIFICATION | RTD6400 and RTD6800 |
|---|---|
| Work Piece Dimensions | RTD6400: 150 mm L x 100 mm W x 200 mm H RTD6800: 150 mm L x 200 mm W x 200 mm H |
| Loading Length | 150 mm - 225 mm (with extended web option) |
| Workpiece Weight (Max) | 180 Kg | Yoke Speed (min-max) | min: 0.001 max: 200 |
| Power Requirements | 30 amp, 3-phase, 220 volt, 50/60 Hz |
| Compressed Air | Pressure: 207 kPa (80 psi) Volume: 0.14 m³/min (5 cfm) |
| Cutting Fluid Tank Capacity | 110 L |
MWX250 Multi-Wire
FEATURES
- Reel-to-Reel Diamond Wire saw capable of multi-wire slicing up to 100mm of material in a single pass
- Designed to meet the emerging need of SiC Cropping and Seed generation
- Proven technology based on NCX250
- Minimal footprint: 42” Wide x 28” Deep x 80” Tall, ~700kg (1500lbs)
- 10” Touch-screen Graphic User Interface • MES Capable
BENEFITS
- Slip-on wire guides for quick turn from process to process
- Compact footprint to minimize space requirements
- Adaptable from multi-wire to single-wire configuration in minutes allowing for the throughput of a multi-wire saw with the versatility of a single-wire saw
- Increased working speed over conventional slurry process
- High-end Yaskawa controls with load cell feedback for high wire speed and consistent tension control
- Fixturing available for automated integration
- Wire break detection is standard
| SPECIFICATION | MWX250 |
|---|---|
| Work Piece Dimensions | 250 mm x 250 mm x100 mm (235 mm of table travel for single-wire application) |
| Work Table | Optional |
| Saw Dimensions | W: 1104 mm / 43.46" H: 2047 mm / 80.56" D: 924 mm / 36.37" |
| Saw Weight (Max) | 583 Kg 1285 Lbs |
| Diamond Wire | Max capacity: Up to 15km of 175μm core wire |
| Power Requirements (V/f/A/ph) | 480 V / 50-60 Hz 20 Amp 3 phase |
| Yoke Speed (mm/min) | min: 0.001 max: 200 |
| Wire Speed (m/s) | max: 30 m/s |
| Tension | up to 45 N |
| Fluid Tank | 70 Liter 18.5 Gallon |
| Indexing Table Accuracy (mm) | Standard: ±0.015 Optional: ±0.003 |
| Wire Web | 100 mm web length wth a minimum pitch of 0.500 mm |
The RTD Series Multi-Wire Saws in Action:
- Cuts extremely hard and or extremely brittle materials effectively and gently with superior finishes
- Fantastic solution for sapphire, ceramics, quartz, optic glass, medical applications, compound semiconductors
- Small footprint and low operating costs
- Versatile multi-wire diamond saws bring efficient cutting with speed, precision, and material savings
Our products are designed and manufactured in North America.