RTD Series Multi-Wire Saw
FEATURES
- Processes Ingots up to 200mm diameter and 225mm long with as many as 300 slices at a time
- Minimally destructive, low-kerf slicing with diamond wire increases yield by saving material
- Simple, robust design minimizes maintenance costs and reduces downtime
- Operator-friendly 15”, Color Touchscreen allows for simple programming of recipes and ease of use
- Tangential cutting method for increased surface finish quality and decreased cut time
- PLC controlled tensioning system with load cell feedback for accurate wire tension required for different wire sizes
- Smallest footprint available in a multi-wire saw (1.3 m²)
- Multiple wire break detection systems minimizes material loss due to wire breaks
- CE compliant
BENEFITS
- Ideal for cutting hard and brittle materials such as: silicon, silicon carbide, quartz, fused silicon glass, ceramics, graphite, sapphire, germanium, etc.
- Increased working speed over conventional slurry process
- Adaptable design allows for many different process types from single-wire cropping to multi-wire slicing
- Efficient wire usage - increases cutting speed and enables wire changes in minutes
- Wire break detection is standard
Features of the RTD Series Multi-Wire Saws
- Cuts extremely hard and or extremely brittle materials effectively and gently with superior finishes
- Fantastic solution for sapphire, ceramics, quartz, optic glass, medical applications, compound semiconductors
- Small footprint and low operating costs
- Versatile multi-wire diamond saws bring efficient cutting with speed, precision, and material savings
Our products are built and manufactured in North America.