
Diamond Wire
Manufacturer of diamond slicing wire. Diameter range from 60 µm to 400 µm.
Key benefit -- reduced cost of ownership!
Faster cut times:
- 6 - 8 times faster than slurry, application dependent
- Increased capacity with lower capital expenditures
- Faster ROI to justify initial capital investment
Roadmap to lower wafer cost and higher throughput:
- Lower cost from reduced total cost of ownership
- Less expensive secondary process costs
- Re-use of wire
- Reduced utilities
Reduce production complexity:
- Reduced running costs such as electricity and cooling water
- Bundled consumables for optimized processing

IWT 710 Slicing Beams
With strong performance to improve global cutting results
Custom sizes available
Benefits:
- Reduced cost ownership up to five times compared to competitive materials
- Light weight results in lower shipping cost
- Polyurethane technology contains no mineral filters reducing the risk of contaminating wire guide rolls and machine
- Special design to maximize the lifetime
- Custom shapes and sizes available to maximize efficiency
- Easy to handle and compatible with water based cutting fluid

Fluids for Slicing
We know how fluids are important part of the process.
Benefit:
To optimize and increase your productivity we provide:
Fluids for beams:
- WaferKool 2010
- WaferKool 3010
Saw cleaners:
- SawKleen
Please contact us for additional information.