Diamond Wire Slicing

Diamond Wire

Manufacturer of diamond slicing wire. Diameter range from 60 µm to 400 µm.

Key benefit -- reduced cost of ownership!  

Faster cut times:  

• 6 - 8 times faster than slurry, application dependent
• Increased capacity with lower capital expenditures
• Faster ROI to justify initial capital investment

Roadmap to lower wafer cost and higher throughput:

• Lower cost from reduced total cost of ownership
• Less expensive secondary process costs
• Re-use of wire
• Reduced utilities

Reduce production complexity:

• Reduced running costs such as electricity and cooling water
• Bundled consumables for optimized processing  

IWT 710 Slicing Beams

With strong performance to improve global cutting results
Custom sizes available

Benefits:

• Reduced cost ownership up to five times compared to competitive materials
• Light weight results in lower shipping cost
• Polyurethane technology contains no mineral filters reducing the risk of contaminating wire guide rolls and machine
• Special design to maximize the lifetime
• Custom shapes and sizes available to maximize efficiency
• Easy to handle and compatible with water based cutting fluid

Fluids for Slicing

We know how fluids are important part of the process.

Benefit:

To optimize and increase your productivity we provide:

Fluids for beams:

• WaferKool 2010
• WaferKool 3010

Saw cleaners:

• SawKleen

Please contact us for additional information.