(719) 570-1150

Diamond Wire Slicing

Consumables and Tooling

Magnification of a diamond wire

Diamond Wire

SOMOS IWT partners with a leading wire manufacturer to offer high-performance diamond wire with customizable specifications:  
  • Core diameters from 100 μm to 400 μm
  • Various diamond size and distribution optionss
  • Multiple concentration and Ni coating thickness variations
  • Conditioning options based on application requirements
Key benefit:   
  • Reduced cost of ownership
  • Faster cut times — 6–8× faster than slurry-based systems (application dependent)
  • Increased production capacity with lower capital investment
Diamond wire slicing beams

IWT 710 Slicing Beams

High-performance slicing beams designed for durability, stability, and long-term value. 
Benefits:   
  • Up to 5× reduction in ownership cost
  • Polyurethane formulation contains no mineral fillers, minimizing contamination risk
  • Engineered to maximize service life
  • Available in custom shapes and sizes
  • Lightweight and fully compatible with water-based cutting fluids
Diamond wire cutting fluids

Fluids for Slicing

Optimized for performance, yield, and process stability.
Slicing Fluids:   
  • WaferKool 2010
  • WaferKool 3010
Saw Cleaners:   
  • SawKleen – environmentally friendly and easy to dispose
Man in laboratory inspecting semiconductor wafer
Hard drive storage disk
Four surface preparation examples
Single-side polishing machine
Large boule being cut by a diamond wire
Smooth material example cuts
SOMOS-IWT logo

Flag of the United States  Our products are designed and manufactured in North America.

3525 North Stone Avenue, Ste 100, Colorado Springs, CO 80907, USA
(719) 570-1150
FINE GRINDING, LAPPING & POLISHING
DIAMOND WIRE SAWS