SOMOS IWT has worked together with our customers to create custom, diamond wire saw equipment solutions to the high-technology sectors for 36 years.
We engineered, designed, developed and manufactured custom machine designs to our single-wire and multi-wire machine architectures.
Examples of these projects are as follows:
Custom Wire Saw with Robotics
- Fully automated wire saw production line
- Includes robotics
![Custom Wire Saw with Robotics](/images/diamond-wire/M2WX.jpg)
CR200
Multi-Head Slicing for Semiconductor Silicon Boule
![CR200 – Multi-Head Slicing for Semiconductor Silicon Boule](/images/diamond-wire/CR200-2.jpg)
![CR200 – Multi-Head Slicing for Semiconductor Silicon Boule](/images/diamond-wire/CR200-1.jpg)
MCP650
Multi-head Cropping Saw for Sapphire
- For large boules (Up to 262kg)
- Multi-wire heads for slicing boules into blocks in a single pass
- 12 tools installed
![Cad drawing of the MCP650 – Multi-head Cropping Saw for Sapphire](/images/diamond-wire/MCP650-1.jpg)
![MCP650 during assembly. A Multi-head Cropping Saw for Sapphire](/images/diamond-wire/MCP650-2.jpg)
CR360
Multi-Head Slicing System for Photovoltaic Si Boule
- For large boules (Up to 3m long)
- 6-Head Adjustable System
- 3 tools installed
![CR360 – Multi-Head Slicing System for Photovoltaic Si Boule](/images/diamond-wire/CR360-1.jpg)
![CR360 – Multi-Head Slicing System for Photovoltaic Si Boule](/images/diamond-wire/CR360-2.jpg)
SR200
Filament Saw for Si Wafer “Seed” Material
- For large boules (Up to 3m long)
- Multi-wire heads for slicing seeds in a single pass
![SR200 – Filament Saw for Si Wafer “Seed” Material](/images/diamond-wire/SR200-3.jpg)
![SR200 – Filament Saw for Si Wafer “Seed” Material](/images/diamond-wire/SR200-1.jpg)
![SR200 – Filament Saw for Si Wafer “Seed” Material](/images/diamond-wire/SR200-2.jpg)