MULTI-WIRE SAW
RTD SERIES
Engineered for high-precision multi-wire slicing, the RTD Series produces extremely thin, repeatable slices for applications requiring tight tolerances, controlled kerf loss, and consistent material yield.
CLOSED CONFIGURATION
OPEN CHAMBER VIEW
CUT ENVELOPE
RTD 6400 — 101 × 203 × 150 mm
RTD 6800 — 203 × 203 × 150 mm
RTD 6800+ — 203 × 203 × 225 mm
Width × Height × Depth
WIRE SPEED
12 m/s
WIRE TENSION
Max 40 N
MACHINE FOOTPRINT
1450 × 865 mm
Width × Depth
POWER REQUIREMENTS
208–230 VAC
3-phase standard
RTD PLATFORM
Features & Benefits
The RTD Series combines precision multi-wire control, configurable cutting depth, low-kerf processing, and recipe-based operation to produce extremely thin slices with repeatable geometry, tight tolerances, and improved material yield.
Thin-Slice Capability
Supports slice thicknesses from 0.5 mm to 6 mm for applications requiring precise, repeatable thin-section production.
Configurable Cutting Depth
Compatible with 150 mm wire guides, with an optional 225 mm configuration for applications requiring additional cutting depth.
Low-Kerf Material Yield
Controlled multi-wire slicing reduces kerf loss and preserves more usable material from each workpiece.
Precision Tension Control
PLC-controlled tension with load-cell feedback maintains consistent wire control throughout the slicing process.
Recipe-Based HMI
The touchscreen HMI stores up to 40 process recipes for repeatable setup, operating consistency, and efficient changeovers.
Hard-Material Processing
Designed for silicon carbide, sapphire, and other advanced materials requiring thin slices and tight dimensional control.
RTD CAPABILITIES
Applications & Materials
Developed for production environments requiring parallel slicing, repeatable geometry, controlled tolerances, and increased output.
Typical Applications
Developed for precision multi-wire applications requiring extremely thin slices, repeatable geometry, and tight process tolerances.
- Thin-section slicing
- Precision multi-wire production
- Material qualification
- Process development
- Research and development
- Specialty production
Typical Materials
Suitable for hard crystalline and advanced materials where low kerf loss, consistent slice thickness, and controlled processing are critical.
- Silicon carbide
- Sapphire
- Neodymium
- Advanced crystalline materials
- Application-specific production materials
RTD SERIES
Explore the RTD Platform
View the RTD Series cutting chamber, multi-wire system, operator controls, precision wire guides, and production configurations.