SINGLE-WIRE CROPPING SAW
CR SERIES
Engineered for large-format cropping applications, the CR Series combines a generous cutting envelope, high wire speed, and closed-loop tension control to process oversized materials while preserving usable yield.
CLOSED CONFIGURATION
OPEN CHAMBER VIEW
CUT ENVELOPE
CR 250 — 250 × 500 × 300 mm
CR 350 — 350 × 500 × 300 mm
CR 500 — 500 × 500 × 300 mm
Width × Height × Depth
WIRE SPEED
25 m/s
WIRE TENSION
Max 100 N
PLC-controlled with load-cell feedback
MACHINE FOOTPRINT
1640 × 1090 mm
Width × Depth
POWER REQUIREMENTS
480 VAC
3-phase standard
CR PLATFORM
Features & Benefits
The CR Series combines large-format cutting capacity, high-speed wire operation, precision tension control, and repeatable positioning to crop oversized materials efficiently while minimizing kerf loss and preserving valuable material.
Large-Format Capacity
Three available configurations accommodate materials up to 500 mm wide, 500 mm high, and 300 mm deep.
Improved Material Yield
Low-kerf diamond wire cropping reduces material waste and preserves more usable material from each workpiece.
High-Efficiency Cutting
Wire speeds up to 25 m/s support efficient cropping and increased throughput for large-format applications.
Closed-Loop Tension Control
PLC-controlled tension with load-cell feedback maintains precise wire control and supports wire sizes up to 350 µm.
Recipe-Based HMI
The touchscreen HMI stores up to 30 process recipes for repeatable setup and consistent operation.
Precision Indexing
A standard precision indexing table supports controlled positioning and repeatable cropping performance.
CR CAPABILITIES
Applications & Materials
Developed for precision slicing and production work involving hard crystalline materials and demanding process requirements.
Typical Applications
Developed for large-format cropping and material-sizing operations where usable yield, controlled kerf loss, and repeatable positioning are critical.
- Large-format material cropping
- Ingot and block sizing
- End cropping and material preparation
- Material qualification
- Process development
- Specialty and production cropping
Typical Materials
Suitable for oversized crystalline and advanced materials that benefit from controlled diamond wire cutting and reduced material loss.
- Large crystalline materials
- Semiconductor materials
- Advanced ceramics
- Optical materials
- Permanent-magnet materials
- Application-specific advanced materials
CR SERIES
Explore the CR Platform
View the CR Series cutting chamber, large-format work area, controls, wire-management components, and application configurations.