MULTI-WIRE SAW

MWX SERIES

Engineered for production environments requiring tight tolerances and increased throughput, the MWX Series produces multiple precise slices per pass while maintaining repeatable geometry, controlled kerf loss, and superior surface quality.

CLOSED CONFIGURATION

OPEN CHAMBER VIEW

CUT ENVELOPE

Circular — Ø250 × 100 mm
Square — 200 × 200 × 100 mm

Diameter/Width × Height × Depth

WIRE SPEED

25 m/s

WIRE TENSION

Max 45 N

MACHINE FOOTPRINT

1075 × 930 mm

Width × Depth

POWER REQUIREMENTS

480 VAC

3-phase standard

MWX PLATFORM

Features & Benefits

The MWX Series combines high-speed multi-wire slicing, closed-loop tension control, configurable wire spacing, and recipe-based operation to produce multiple precise slices per pass with consistent geometry, improved surface quality, and efficient material utilization.

Multi-Wire Productivity

Multiple-wire capability produces numerous slices during each pass, significantly increasing output compared with single-wire processing.

Configurable Wire Pitch

Supports wire spacing from 2–5 mm and configurations of up to 50 wraps for application-specific slice requirements.

High-Speed Cutting

Wire speeds up to 25 m/s support efficient processing and production-oriented throughput.

Closed-Loop Tension Control

PLC-controlled tension with load-cell feedback maintains consistent wire control across multiple active wires.

Recipe-Based HMI

The touchscreen HMI stores up to 30 process recipes for repeatable setup, operating consistency, and faster changeovers.

Reduced Kerf Loss

Controlled diamond wire slicing improves usable material yield, supports better surface finish, and reduces material waste.

MWX CAPABILITIES

Applications & Materials

Developed for production environments requiring parallel slicing, repeatable geometry, controlled tolerances, and increased output.

Typical Applications

Configurable for precision cutting needs from early process evaluation through production use.

  • Parallel multi-wire slicing
  • Multiple-slice production
  • High-throughput material processing
  • Process development
  • Material qualification
  • Specialty production

Typical Materials

Suitable for hard crystalline, magnetic, and advanced materials requiring efficient multi-wire processing and controlled material loss.

  • Silicon carbide
  • Sapphire
  • Neodymium
  • Other advanced crystalline materials
  • Application-specific production materials